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Silicone Gel Encapsulation Materials in Power Electronic Modules Self-Healing
SI6715-6 Silicone Gel Encapsulation Materials in Power Electronic Modules Self-Healing Properties and Influencing Factors
Product features and applications
GEL 6715-6(1#) is a transparent two-component self-healing silicone gel. After curing, it forms a special soft material that is buffered and automatically recovered. It is designed to insulate circuit boards from moisture and other harmful contaminants, and to provide insulation against high voltages. Another use is to provide stress relief to protect circuits and components from high temperature and mechanical stress.
l 1:1 additive molding, strong adhesion, self-healing
l High elongation; Excellent flexibility, eliminating mechanical stress
l Very low oil permeability after curing, excellent resistance to toxicity
l High temperature electrical insulation is excellent, to provide protection against high pressure
l Excellent aging resistance and weather resistance
l Excellent waterproof, anticorrosive, moisture-proof, chemical medium resistance
l It can be used in semiconductor modules, connectors, sensors, etc
Typical Applications
Power semiconductor IGBT, load sensor, automotive ECU integrated module and other package protection IC chip, power telecommunication waterproof connector potting and sealing.
Pre-curing characteristics
| Component A | Component B |
Appearance | Colorless clear liquid | Colorless clear liquid |
Viscosity,25℃ CPS | 400-500 | 350-450 |
Density, g/cm | 0.97±0.05 | 0.97±0.05 |
Mixing ratio | A: B = 100:100 weight ratio | |
Viscosity after mixing | 450-550 CPS | |
Operating time after mixing | 25 ℃, 15-25 minutes | |
Tack free time,min | 25 ℃, 45-90 minutes | |
Hardening conditions | 10-12 hours at 25 ℃ or 30 minutes at 80℃ | |
Appearance | Colorless clear gel | |
Penetration 1/4 mm | 75± 5 (A： B = 1： 1) 115± 10 (A： B = 1 ：0.75) | |
Dielectric strength (KV/mm) | 25 | |
Volume resistance (Ω·cm) DC500V | 1.0 × 1014 | |
Loss factor (1 MHz) | < 0.001 | |
Dielectric constant (1 MHz) | 2.8 | |
Use temperature range | - 60 ∞ 250 ℃ | |
Note: When A:B= 1:0.75 is required, the curing condition is 45 minutes at 80℃, and the cured surface is free of oil.
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