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SI350 Electric Two-Component Transparent Silicone Gel Liquid Waterproof Sealant
SI350 Electric Two-Component Transparent Silicone Gel Liquid Waterproof Sealant
Product description
GEL 350 is a two-component robust gel that cures to form a soft cushioned flexible material. It is designed to insulate circuit boards from moisture and other harmful contaminants and to provide insula tion against high voltages. Another use is to provide stress relief to protect circuits and interconnectors from high temperature and mechanical stress.
l 1:1 addition molding for easy operation
l Excellent flexibility, eliminate mechanical stress
l Very low oil permeability after curing, excellent resistance to toxicity
l High temperature electrical insulation is excellent, to provide protection against high pressure
l Excellent aging resistance and weather resistance
l Excellent waterproof, anticorrosive, moisture-proof, chemical medium resistance
l It is suitable for cable connection box, waterproof junction box and underwater instrument
l Widely used in power electronics, ignition module potting
Typical performance
Pre-cure characteristics | GEL 350 transparent | |
Composed | A Component | Component B |
Appearance | Colorless clear liquid without impurities | Colorless clear liquid without impurities |
Viscosity, mPa ·s(25℃) | 1000± 150 | 1000± 150 |
Specific gravity, g/cm3(25 ℃) | 0.99 | 0.99 |
Mix ratio, mass ratio | A： B = 100： 100 | |
Viscosity after mixing, mPa ·s(25℃) | 1000± 150 | |
Operation time after mixing, min(25℃) | 30-60 mins | |
Tack free time ,min(25 ℃) | 100± 30 | |
Curing conditions, ℃ | 25℃/ 24/hr or 80℃/10mins | |
Appearance of hardened objects | Clear gel | |
Cone penetration, 1/10mm | 260± 50 | |
Dielectric strength, KV/mm | ≥20 | |
Volume resistance (DC500V), Ω·cm | 1.1 × 1014 | |
Loss factor (1 MHz) | < 0.001 | |
Dielectric constant (1 MHz) | < 3.00 | |
Use temperature range, ℃ | - 60 ∽ 260 | |
PS: Operation time is tested with the amount of glue dispensed 100g.
Curing state All data were determined at 25℃ , 55%RH after 7 days of adhesive curing.
Operation and use process.
l The A and B components are weighed at a ratio of 1:1, mixed evenly, and injected dire ctly into the components (or modules) that n eed to be potting and protected. It is best t
o slowly inject along one side of the wall, w hich can reduce the generation of bubbles.
l The pot-sealed component is left to stand a nd let it bubble by itself. After the bubble ha s basically disappeared, it can be heated an
Precautions
l Vacuum defoaming of AB components after mixing can improve the performance of hard ened products
l A and B components should be sealed and stored after use
Packing specification
d cured (about 10 minutes at 80℃).
l It can also be cured directly at room temper ature. The transparent model cures in about 20mins, and the black model takes about 6 0mins.
l Please consult the Marketing Department of our company for filling and sealing equipmen t requiring quantitative gluing.
l Too low temperature will lead to slow curing speed, it is recommended to heat curing
l GEL 350 will be difficult to harden in con tact with materials containing sulfur, amine,
and tin
GEL 350 silicone gel, order code: A: 2KSI5210; B: 2KSI5211
l Component A: 10L plastic pot
l Component B: 10L plastic pot
l Other packaging can also be customized
Storage and Transportation
l Be kept away from light and heat and sealed (can be transported and stored as non-dangerous goods);
l Storage period 1 year (25℃).
Please dont order directly, any inquiry, welcome to talk more with us +8618321208486
