SI 7435 High Bonding Electronic Grade Silicone adhesive

PS: Operation time is tested with the amount of glue dispensed 140 g.

Curing state All data were determined at 25℃, 55%RH after 7 days of adhesive curing.

Clean before operation

The bonding surface should be clean, dry and free from grease and dust. If the surface is easily peeled off, it should be removed with a metal brush beforehand. If necessary, the surface can be wiped with an organic solvent such as acetone.

Direction of operation

Tool: Manual or pneumatic plunger caulking gun

For cartridge

1.Cut nozzle to give the required angle and bead size

2.Pierce the membrane at the top of the cartridge and screw on the nozzle

Place the cartridge in an applicator gun and squeeze the trigger with equal strength

For sausage

1.Clip the end of the sausage and place in barrel gun

2.Screw end cap and nozzle on to barrel gun

3.Using the trigger extrude the sealant with equal strength

Attention of operation

- The temperature is lower than 10 °C or the dispensing speed is less than the process requirement, the adhesive is recommended to be baked in an oven at 40 ° C ~ 60 ° C for 1 h ~ 3 h.

- When the bonding parts are heavy, apply the auxiliary tools (tape, positioning block, bandage, etc.) after the sizing installation.

- The best construction environment: temperature 15 ° C ~ 30 ° C, relative humidity 40% ~ 65% RH.

- In order to ensure a good adhesive sealing effect and compatibility of the product with the substrate, the actual substrate should be tested in the corresponding environment in advance.Wear suitable protective clothing, gloves and eye/face Protection. After contact with skin, wash immediately with plenty of water and soap. In case of accident or if you feel unwell, seek medical advice immediately

Note：All data above were tested under special condition (7 days after full cured).

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As a manufacturer, we would like to share with you what we have learned about the different types of potting compounds and their characteristics.

The potting compounds on the market vary in viscosity, requirements for cure conditions, among other factors. Compounds such as polyurethane, silicone, and epoxy are widely used in a variety of applications.

Silicone Potting Compounds are soft and flexible, silicone potting compounds and encapsulating materials possess a good level of elongation.Silicone potting compound can also withstand a wide range of temperatures. Most silicone materials are able to operate at temperatures between -40°C and 200°C.

Epoxy potting compounds generally perform as a better adhesive, high-temperature resistance, and chemical resistance and have better adhesion to a wide variety of substrates and typically do not need primers.

Polyurethane Potting Compounds generally have better flexibility, elongation, and abrasion resistance.

Acrylic Potting Compounds are UV and heat-hardening materials, with fast hardening, adequate chemical resistance, and clear appearance.