SI 7336W-1TC White Silicone Adhesive Sealant White Silicone glue
SI 7336W-1TC White Silicone Adhesive Sealant White Silicone glue
Product description
SI 7336W-1TC white silicone adhesive sealant is a neutral silicone sealing material that absorbs moisture in the air and cures at room temperature in one component.
It is non-corrosive to materials, and has good bonding and sealing performance for most plastic metals and other materials, protecting electronic products in a stable state under harsh conditions.
SI 7336W-1TC white silicone adhesive cured elastomer has the following characteristics:
ü SI 7336W-1TC has excellent corrosion-free adhesion to metals, including copper, plastics, ceramics, glass, etc., without the use of primer.
ü Excellent weather resistance, water resistance and chemical resistance
ü Resistance to moisture, dirt and other atmospheric components
ü Excellent electrical insulation properties.
ü High thermal conductivity bonding sealant
ü Stable mechanical and electrical properties between -60 and 250 ° C
Fields of Application
ü Power, solar energy, equipment, home, automotive, LED lighting,
ü Power supply, ECU module, semiconductor, high power transistor, thyristor diode
Technical parameters before and after curing
Test items | Test standard | Units | SI 7336W-1TC |
Before cured | |||
Color | Visual | --- | White |
Appearance | Visual | --- | Slightly collapsed paste |
Extrusion rate | / | 15 g/s, 0.4 Mpa | 150-250 |
Density | GB/T 15223-1994 | 25℃, g/cm3 | 1.65±0.05
|
Tack-free Time | GB/T13477.5-2002 | 25℃, 55%RH,min | ≤20 |
After cured
| |||
Hardness | GB/T 531.1-2008 | Shore A | 70±5
|
Thermal conductivity | GB/T 10297-2015 | W/m.K | ≥0.75 |
Elongation at break | GB/T 528-2009 | % | ≥70% |
Tensile strength | GB/T 528-2009 | Mpa | ≥2
|
Dielectric strength | GB/T 1695-2005 | kV/mm (25 ° C) | 20 |
Loss factor | GB/T 1693-2007 | (1MHz) (25℃) | 0.09 |
Dielectric constant | GB/T 1693-2007 | (1MHz) (25℃) | 2.9 |
Volume Resistance | GB/T 1692-2008 | (DC500V) Ω· cm | ≥1.0*1014 |
All the above data were determined or further experimental tested after 7 days of adhesive curing at 25℃, 55%RH.






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