SI 7315 1.5W/MK White Color thermal conductivity silicone adhesive Sealant
SI 7315 1.5W/MK White Color thermal conductivity silicone adhesive Sealant
Product description
SI 7315 is hygroscopic curing of neutral dealcoholized silicone, adding special thermal conductive materials made of thermal silica gel, after curing to form a flexible rubber body, fully in line with the EU ROHS directive requirements. The release of alcohols during the curing process is non-corrosive to polycarbonate (PC), copper and other materials, and has good bonding and sealing performance for most materials, protecting electronic products in a stable state under harsh conditions.
The elastomer cured by SI 7315 silicone adhesive sealant has the following characteristics:
ü It has a high thermal conductivity
ü The rubber layer is elastic, not yellow, not oil infiltration, excellent comprehensive performance
ü Resistant to moisture, dirt and other atmospheric components
ü Reduces mechanical stress and tension caused by mechanical, thermal shock and vibration
ü Excellent electrical insulation and corona resistance
ü Excellent outdoor aging, service life of up to 20-30 years
ü Stable mechanical and electrical properties between -60 and 200℃
Fields of Application
ü LED lighting seal; Automotive electronic components cooling; PCB board and electronic components cooling positioning seal;
ü High power transistor, thyristor diode and substrate (aluminum, copper) gap filling.
Prehardening characteristic
Test items | Test standard | Unit | 7315 |
Color | Visual | --- | White paste |
Extrusion rate | 25 ℃ | g/15s | 20-40 |
Density | GB/T 15223-1994 | 25℃, g/cm3 | 2.8±0.05 |
Tack-free Time | GB/T13477.5-2002 | 25℃, 55%RH,min | ≤20 |
Hardness | GB/T 531.1-2008 | Shore A | 70±5 |
Thermal conductivity | GB/T 10297-2015 | W/m.K | >1.5 |
Elongation at break | GB/T 528-2009 | % | ≥50 |
Tensile strength | GB/T 528-2009 | Mpa | ≥2.0 |
Shear strength | GB/T 7124-2008 | Mpa, Iron/iron | ≥1.2 |
Dielectric strength | GB/T 1695-2005 | kV/mm (25 ° C) | 20 |
Loss factor | GB/T 1693-2007 | (1MHz) (25℃) | 0.09 |
Dielectric constant | GB/T 1693-2007 | (0.5 MHz) (25 ° C) | 4.8 |
Volume resistance | GB/T 1692-2008 | (DC500V) Ω· cm | ≥1.0*1014 |
All the above data were determined after 7 days of adhesive curing at 25℃, 55%RH. The company is not responsible for the different data caused by different test conditions or product improvement.
PS: The operating time and curing time are tested with the dispensing amount of 100g. All the data of curing state were determined after 7 days of adhesive curing at 25℃ and 55%RH.






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