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SI 7315 1.5W/MK White Color thermal conductivity silicone adhesive Sealant

£18.00Price
£18.00 per 310 Milliliters
Quantity

SI 7315 1.5W/MK White Color thermal conductivity silicone adhesive Sealant


Product description


SI 7315 is hygroscopic curing of neutral dealcoholized silicone, adding special thermal conductive materials made of thermal silica gel, after curing to form a flexible rubber body, fully in line with the EU ROHS directive requirements. The release of alcohols during the curing process is non-corrosive to polycarbonate (PC), copper and other materials, and has good bonding and sealing performance for most materials, protecting electronic products in a stable state under harsh conditions.

The elastomer cured by SI 7315 silicone adhesive sealant has the following characteristics:

ü It has a high thermal conductivity

ü The rubber layer is elastic, not yellow, not oil infiltration, excellent comprehensive performance

ü Resistant to moisture, dirt and other atmospheric components

ü Reduces mechanical stress and tension caused by mechanical, thermal shock and vibration

ü Excellent electrical insulation and corona resistance

ü Excellent outdoor aging, service life of up to 20-30 years

ü Stable mechanical and electrical properties between -60 and 200℃

Fields of Application

ü LED lighting seal; Automotive electronic components cooling; PCB board and electronic components cooling positioning seal;

ü High power transistor, thyristor diode and substrate (aluminum, copper) gap filling.

Prehardening characteristic

Test items

Test standard

Unit 

7315

Color

Visual

---

White paste

Extrusion rate

25 ℃

g/15s

20-40

Density

GB/T 15223-1994

25℃, g/cm3

2.8±0.05

Tack-free Time

GB/T13477.5-2002

25℃, 55%RH,min

≤20

Hardness

GB/T 531.1-2008

Shore A

70±5

Thermal conductivity

GB/T 10297-2015

W/m.K

>1.5

Elongation at break

GB/T 528-2009

%

≥50

Tensile strength

GB/T 528-2009

Mpa

≥2.0

Shear strength

GB/T 7124-2008

Mpa, Iron/iron

≥1.2

Dielectric strength

GB/T 1695-2005

kV/mm (25 ° C)

20

Loss factor

GB/T 1693-2007

(1MHz) (25℃)

0.09

Dielectric constant

GB/T 1693-2007

(0.5 MHz) (25 ° C)

4.8

Volume resistance

GB/T 1692-2008

(DC500V) Ω· cm

≥1.0*1014

All the above data were determined after 7 days of adhesive curing at 25℃, 55%RH. The company is not responsible for the different data caused by different test conditions or product improvement.

PS: The operating time and curing time are tested with the dispensing amount of 100g. All the data of curing state were determined after 7 days of adhesive curing at 25℃ and 55%RH.

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