Ep3115(#4) High thermal conductivity 0.7W/M.K Epoxy Potting Compound Sealant

Ep3115(#4) High thermal conductivity 0.7W/M.K Epoxy Potting Compound Adhesive

A 0.7 W/m·K epoxy potting compound sealant is a specialized, moderately thermally conductive resin designed to protect electronic assemblies while actively dissipating heat.

EP 3225(4#)A/B has the following characteristics:

l Excellent bond and cracking resistance

l Low CTE linear expansion coefficient

l High thermal conductivity

l Excellent electrical insulation and stability

l It is used in the temperature range of -50℃-180℃

l Water absorption is very low, good water and moisture resistance

l Excellent adhesion to metals (iron, aluminum and copper)

Key Features to Expect

Operating Temperatures: Designed for extreme environments, typically spanning -50~+200℃

(with some specialty formulations withstanding up to +200℃

Electrical Isolation: While highly conductive to heat, these epoxies offer excellent electrical insulation, protecting circuitry against voltage spikes and static.

Environmental Resistance: The cured compounds create a resilient barrier against moisture, salt water, humidity, and mild chemicals. 

Common Applications

• Power Supplies: Encapsulating transformers, drivers, and power converters to mitigate heat build-up.

• Automotive Electronics: Protecting under-the-hood sensors, control modules, and electric vehicle battery components from harsh environments.

• Industrial Controls: Sealing heavy-duty relays, switches, and outdoor circuit boards against moisture and dust.

• LED Drivers: Wicking away heat from high-brightness lighting modules to significantly extend their operational lifespan

Epoxy is designed for staking and encapsulating electronics on circuit boards.