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Ep3115(#2) High thermal conductivity 1.5W/M.K Epoxy Potting Compound Adhesive
Ep3115(#2) High thermal conductivity 1.5W/M.K Epoxy Potting Compound Adhesive
For a high thermal conductivity potting compound/adhesive in the1.5w/mk range, the industry-standard formulation . This Black, two-part epoxy system provides superior heat dissipation for demanding electronics while doubling as a flame-retardant structural adhesive that meets the UL94 V-0 standard.
Key Features to Expect
Operating Temperatures: Designed for extreme environments, typically spanning -50~+200℃
(with some specialty formulations withstanding up to +200℃
Electrical Isolation: While highly conductive to heat, these epoxies offer excellent electrical insulation, protecting circuitry against voltage spikes and static.
Environmental Resistance: The cured compounds create a resilient barrier against moisture, salt water, humidity, and mild chemicals.
Typical Applications
Encapsulating power supplies, transformers, and inverters.
Potting LED drivers and heavy-duty power tool electronics.
Heat sink attachment and high-power die bonding
Epoxy is designed for staking and encapsulating electronics on circuit boards.
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