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Ep3115(#2) High thermal conductivity 1.5W/M.K Epoxy Potting Compound Adhesive
Ep3115(#2) High thermal conductivity 1.5W/M.K Epoxy Potting Compound Adhesive
For a high thermal conductivity potting compound/adhesive in the1.5w/mk range, the industry-standard formulation . This Black, two-part epoxy system provides superior heat dissipation for demanding electronics while doubling as a flame-retardant structural adhesive that meets the UL94 V-0 standard.
Key Features to Expect
Operating Temperatures: Designed for extreme environments, typically spanning -50~+200℃
(with some specialty formulations withstanding up to +200℃
Electrical Isolation: While highly conductive to heat, these epoxies offer excellent electrical insulation, protecting circuitry against voltage spikes and static.
Environmental Resistance: The cured compounds create a resilient barrier against moisture, salt water, humidity, and mild chemicals.
Typical Applications
Encapsulating power supplies, transformers, and inverters.
Potting LED drivers and heavy-duty power tool electronics.
Heat sink attachment and high-power die bonding
Epoxy is designed for staking and encapsulating electronics on circuit boards.
EP 3209A/B Two Component Black Epoxy Structural Adhesive
Product description
EP 3209A/B Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component bonding adhesive is designed for metal bonding, bonding of cube or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, internal structure bonding of lithium battery module, soft magnetic unit potting, high temperature sensor potting, etc.
EP 3209A/B epoxy adhesive can cure in both room temperature and heating environment. After thoroughly mixing component A and component B at 100:50 (weight ratio), the product cures within a certain period of time to form protection.
The cured glue has the following properties:
Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Excellent high and low temperature resistance, -50℃-180℃
Transformer oil resistance, low attenuation
It has good adhesion to glass fiber cloth, aluminum and plastic, aluminum and aluminum and steel plate
Technical parameters before and after curing:
Test items Test standard Unit Part A Part B
Appearance Visual --- Black paste Beige paste
Viscosity GB/T 2794-2022 25 ° C, mPa·s 350,000±10,000 30,000±70,000
Density GB/T 13354-1992 25 ° C, g/cm3 1.12±0.05 1.03±0.05
Mixing ratio Mass ratio Ratio=A:B 100:50
Mixing ratio Volume ratio Ratio=A:B 100:50
Mixing viscosity GB/T 2794-2022 25 ° C, Pa·s 150,000±30,000
Operating time GB/T 2794-2022 25 ° C, 100g, min 70±10
Hardness GB/T 531.1-2008 Shore D 85±5
Peel strength GB/T 528-2009 Kgf/cm2, Fe/Fe 240
Kgf/cm2, AI/AI 226
T-peel strength GB/T 2791-1995 N/mm(25℃) 6
Shear strength GB/T 7124-2008 mPa·s ≥20
Impact strength GB/T 1843-2008 KJ/m2 15
Glass transition temperature GB/T 22567-2008 ℃ 110
Coefficient of thermal expansion GB/T 1036-2008 U m/m / ℃ <Tg, 45
>Tg, 152
Thermal cracking temperature TGA 10℃/min ℃ 290
Water absorption GB/T 8810-2005 24h, 25 ° C, % 0.45
Dielectric strength GB/T 1692-2008 kV/mm (25 ° C) 22
Dielectric loss GB/T 1693-2007 (1MHz) (25 ° C) 0.006
Dielectric constant GB/T 1693-2007 (1MHz) (25 ° C) 3.1
Volume resistance GB/T 1692-2008 DC500V,Ω· cm 5.20E +14
EP 3090 transparent epoxy structural adhesive
Order code: A: 2KEP6670; B: 2KEP6671; A+B: 2KEP6672
MDEP 3090 black epoxy structural adhesive
Order code: A: 2KEP6611; B: 2KEP6671; A+B: 2KEP6678
l Component A: 1 kg/barrel; Component B: 1kg/ bottle;
l Component A: 5 kg/barrel; Component B: 5kg/ bottle;
l A+B double tube package, 50ml/ bottle
l A+B double tube package, 400ml/ piece
Please don't order directly, if you have any doubts, welcome to talk more with us.+8618321208486
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