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Ep3115 Potting Compound 0.6W/MK Epoxy Thermal Adhesive Waterproof Sealant
Ep3115 Potting Compound Epoxy 0.6W/mk Thermal Adhesive Waterproof Sealant Electronics
Thermally conductive epoxy potting sealants are designed to dissipate heat from sensitive electronic assemblies while providing excellent electrical insulation. Unfilled epoxies typically have low values of 0.14w/mk. So compound of 0.6W/mk use ceramic or metallic fillers to significantly boost heat transfer.
Key Performance Properties
Heat Dissipation: Efficiently transfers heat away from hot spots (like CPUs and transformers) to heat sinks, preventing thermal runaway.
Environmental & Electrical Protection: Offers superior dielectric strength for electrical insulation alongside rugged resistance to moisture, humidity, and vibrations.
Formulation & Cure: These are frequently two-part (A:B=100:15) systems that cure either at room temperature or with mild heat
Typical Applications
Encapsulating PCBs and electronic modules to create an environmental seal.
Potting transformers, coils, and relays to improve heat transfer and prevent overheating.
Insulating AC/DC power supplies and automotive electronics
