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Ep3115 Potting Compound 0.6W/MK Epoxy Thermal Adhesive Waterproof Sealant
Ep3115 Potting Compound Epoxy 0.6W/mk Thermal Adhesive Waterproof Sealant Electronics
Thermally conductive epoxy potting sealants are designed to dissipate heat from sensitive electronic assemblies while providing excellent electrical insulation. Unfilled epoxies typically have low values of 0.14w/mk. So compound of 0.6W/mk use ceramic or metallic fillers to significantly boost heat transfer.
Key Performance Properties
Heat Dissipation: Efficiently transfers heat away from hot spots (like CPUs and transformers) to heat sinks, preventing thermal runaway.
Environmental & Electrical Protection: Offers superior dielectric strength for electrical insulation alongside rugged resistance to moisture, humidity, and vibrations.
Formulation & Cure: These are frequently two-part (A:B=100:15) systems that cure either at room temperature or with mild heat
Typical Applications
Encapsulating PCBs and electronic modules to create an environmental seal.
Potting transformers, coils, and relays to improve heat transfer and prevent overheating.
Insulating AC/DC power supplies and automotive electronics
PU 6030 Light yellow translucent Polyurethane potting compound
PU 6030 is a two-component solvent-free polyurethane material at room temperature or heat curing. It is light yellow and transparent after curing. It is used for two-component sealing, filling, flame and other fields. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating curing can be, can be deep curing, curing less heat, low shrinkage rate; Excellent
flexibility after curing, with good flame retardant effect.
l Excellent low temperature characteristics, excellent weather resistance
l Excellent flame retardancy, 94 V-0
l Excellent electrical insulation, stability
Typical application
l This product is often used in electronic capacitors, automotive electronic module potting;
l Household appliances such as lampblack stove, microwave oven, rice cooker, washing machine,
l Good water resistance, moisture resistance, water absorption is very low
l Good adhesion to most metals and plastics air conditioning control PCB board filling glue seal;
l Life smart toilet, induction toilet, metal induction garbage can circuit board and magnetic coil of moisture and waterproof potting protection.
Conventional performance
Test items Units and Conditions Test standard A / B
Appearance A
Visual Visual Clear yellow fluid
B Visual Clear yellow fluid
A+B Visual Light yellow translucent fluid
Viscosity A
25℃ cps GB/T 2794-2022 600± 350
B GB/T 2794-2022 400±250
A+B GB/T 2794-2022 500±200
Density A 25℃ g/ml GB/T 13354-1992 0.96±0.05
B GB/T 13354-1992 1.10±0.05
Mixing ratio Weight ratio ---- A ： B = 100： 100
Operation time 25℃ min, 150g GB/T 10247-2008 10-20
Gel time 25℃ ,min, 150g GB/T 10247-2008 30-50
Curing conditions C /h, 150g GB/T 10247-2008 25℃/24h or 70℃/2h
Post-cure characteristics
Items Units or conditions Test standard PU 6030
Hardness Shore-A GB/T 531-2008 25-45
Water absorption 24hrs, 25 °C, % GB 8810-2005 < 0.3
Dielectric strength 25 °C, kV/mm GB/T 20028-2005 > 16
Flame resistance UL-94, grade ANSI/UL-94-1985 V-0
Application temperature ℃ GBT 20028-2005 - 60-120
Thermal conductivity W/m.K ASTM D5470 0.2
Volume Resistance 25℃ , Ω·cm GB/T 1692-2008 >1*1012
Version 1.01 / 2026-01 / PU 6030 www.shmaxtech.com
Dielectric constant 50Hz ，25℃ GB/T 1693-2007 3.0
Water vapor transmission rate 23±℃, 50± 5%RH GB/T 1037-2021 11.1 g/m2 24h
* Note: The above performance data is the typical test data of the product at 70% humidity and 25℃ temperature. It is only for the refe rence of customers, and cannot be completely guaranteed to achieve all the data in a specific environment. When using, please refer to the actual data.
