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Ep3113 Two Components 1.0W/MK Thermally Conductive Epoxy Potting Compound
Ep3113 Two Components 1.0W/MK Thermally Conductive Epoxy Potting Compound
1.0 W/(m·K) epoxy potting sealant is an ideal thermal management solution for dissipating heat in electronics while protecting circuits from vibration, dust, and moisture. Because standard epoxies are naturally insulative (around 0.14 W/(m·K)), this value requires specialized ceramic or metallic fillers
Key Performance Properties
When evaluating a 1.0 W/(m·K) epoxy, you can generally expect the following specifications:
Electrical Insulation: High dielectric strength that prevents electrical shorting between closely spaced components.
Mix Ratio: Most RTV or heat-cured systems come in simple 100:8 volume ratios.
Cure Times: Can typically be cured at room temperature or accelerated with elevated heat (e.g., 80 °C).
Environmental Protection: Shields against humidity, salt water, and mild chemicals, allowing for harsh outdoor or industrial environments
Typical Applications
Encapsulating PCBs and electronic modules to create an environmental seal.
Potting transformers, coils, and relays to improve heat transfer and prevent overheating.
Insulating AC/DC power supplies and automotive electronics
