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Ep3112 0.5W/Mk Thermal Conductivity Black Epoxy potting Compound Sealant
Ep3112 0.5W/Mk Thermal Conductivity Black Epoxy potting Compound Sealant
A 0.5 W/mK black epoxy potting compound is a two-part encapsulant used to protect electronic components from moisture, vibration, and thermal shock. It dissipates heat away from sensitive circuits while providing excellent electrical insulation
Key Characteristics
Thermal Conductivity: 0.5w/mk, which is higher than standard unfilled epoxies (typically around 0.15w/mk.
Color & Finish: Opaque black, ideal for hiding internal designs and ensuring permanent masking.
Electrical Insulation: Provides a high dielectric strength.
Viscosity: Generally low to medium mixed viscosity, ensuring the compound flows easily into complex assemblies without leaving air gaps.
Shrinkage: Low volumetric shrinkage during curing to minimize stress on delicate components.
Typical Applications
Encapsulating PCBs and electronic modules to create an environmental seal.
Potting transformers, coils, and relays to improve heat transfer and prevent overheating.
Insulating AC/DC power supplies and automotive electronics
PU 6030 Light yellow translucent Polyurethane potting compound
PU 6030 is a two-component solvent-free polyurethane material at room temperature or heat curing. It is light yellow and transparent after curing. It is used for two-component sealing, filling, flame and other fields. The raw material does not contain heavy metals, green environmental protection, wide process operability, high physical properties of the finished product, and good adhesion to the substrate. Room temperature and heating curing can be, can be deep curing, curing less heat, low shrinkage rate; Excellent
flexibility after curing, with good flame retardant effect.
l Excellent low temperature characteristics, excellent weather resistance
l Excellent flame retardancy, 94 V-0
l Excellent electrical insulation, stability
Typical application
l This product is often used in electronic capacitors, automotive electronic module potting;
l Household appliances such as lampblack stove, microwave oven, rice cooker, washing machine,
l Good water resistance, moisture resistance, water absorption is very low
l Good adhesion to most metals and plastics air conditioning control PCB board filling glue seal;
l Life smart toilet, induction toilet, metal induction garbage can circuit board and magnetic coil of moisture and waterproof potting protection.
Conventional performance
Test items Units and Conditions Test standard A / B
Appearance A
Visual Visual Clear yellow fluid
B Visual Clear yellow fluid
A+B Visual Light yellow translucent fluid
Viscosity A
25℃ cps GB/T 2794-2022 600± 350
B GB/T 2794-2022 400±250
A+B GB/T 2794-2022 500±200
Density A 25℃ g/ml GB/T 13354-1992 0.96±0.05
B GB/T 13354-1992 1.10±0.05
Mixing ratio Weight ratio ---- A ： B = 100： 100
Operation time 25℃ min, 150g GB/T 10247-2008 10-20
Gel time 25℃ ,min, 150g GB/T 10247-2008 30-50
Curing conditions C /h, 150g GB/T 10247-2008 25℃/24h or 70℃/2h
Post-cure characteristics
Items Units or conditions Test standard PU 6030
Hardness Shore-A GB/T 531-2008 25-45
Water absorption 24hrs, 25 °C, % GB 8810-2005 < 0.3
Dielectric strength 25 °C, kV/mm GB/T 20028-2005 > 16
Flame resistance UL-94, grade ANSI/UL-94-1985 V-0
Application temperature ℃ GBT 20028-2005 - 60-120
Thermal conductivity W/m.K ASTM D5470 0.2
Volume Resistance 25℃ , Ω·cm GB/T 1692-2008 >1*1012
Version 1.01 / 2026-01 / PU 6030 www.shmaxtech.com
Dielectric constant 50Hz ，25℃ GB/T 1693-2007 3.0
Water vapor transmission rate 23±℃, 50± 5%RH GB/T 1037-2021 11.1 g/m2 24h
* Note: The above performance data is the typical test data of the product at 70% humidity and 25℃ temperature. It is only for the refe rence of customers, and cannot be completely guaranteed to achieve all the data in a specific environment. When using, please refer to the actual data.
