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Ep3112 0.5W/Mk Thermal Conductivity Black Epoxy potting Compound Sealant
Ep3112 0.5W/Mk Thermal Conductivity Black Epoxy potting Compound Sealant
A 0.5 W/mK black epoxy potting compound is a two-part encapsulant used to protect electronic components from moisture, vibration, and thermal shock. It dissipates heat away from sensitive circuits while providing excellent electrical insulation
Key Characteristics
Thermal Conductivity: 0.5w/mk, which is higher than standard unfilled epoxies (typically around 0.15w/mk.
Color & Finish: Opaque black, ideal for hiding internal designs and ensuring permanent masking.
Electrical Insulation: Provides a high dielectric strength.
Viscosity: Generally low to medium mixed viscosity, ensuring the compound flows easily into complex assemblies without leaving air gaps.
Shrinkage: Low volumetric shrinkage during curing to minimize stress on delicate components.
Typical Applications
Encapsulating PCBs and electronic modules to create an environmental seal.
Potting transformers, coils, and relays to improve heat transfer and prevent overheating.
Insulating AC/DC power supplies and automotive electronics
EP 3209A/B Two Component Black Epoxy Structural Adhesive
Product description
EP 3209A/B Epoxy adhesive is a room temperature/heat curing resin adhesive. This two-component bonding adhesive is designed for metal bonding, bonding of cube or SMC fiberglass parts, aluminum honeycomb plate splicing and magnetic steel tile bonding of motor products, ceramic film component sealing, internal structure bonding of lithium battery module, soft magnetic unit potting, high temperature sensor potting, etc.
EP 3209A/B epoxy adhesive can cure in both room temperature and heating environment. After thoroughly mixing component A and component B at 100:50 (weight ratio), the product cures within a certain period of time to form protection.
The cured glue has the following properties:
Resistance to moisture, dirt, and other atmospheric components
High strength, excellent adhesion
Good pollution resistance, low surface pretreatment requirements
No solvent, no curing byproducts
Excellent high and low temperature resistance, -50℃-180℃
Transformer oil resistance, low attenuation
It has good adhesion to glass fiber cloth, aluminum and plastic, aluminum and aluminum and steel plate
Technical parameters before and after curing:
Test items Test standard Unit Part A Part B
Appearance Visual --- Black paste Beige paste
Viscosity GB/T 2794-2022 25 ° C, mPa·s 350,000±10,000 30,000±70,000
Density GB/T 13354-1992 25 ° C, g/cm3 1.12±0.05 1.03±0.05
Mixing ratio Mass ratio Ratio=A:B 100:50
Mixing ratio Volume ratio Ratio=A:B 100:50
Mixing viscosity GB/T 2794-2022 25 ° C, Pa·s 150,000±30,000
Operating time GB/T 2794-2022 25 ° C, 100g, min 70±10
Hardness GB/T 531.1-2008 Shore D 85±5
Peel strength GB/T 528-2009 Kgf/cm2, Fe/Fe 240
Kgf/cm2, AI/AI 226
T-peel strength GB/T 2791-1995 N/mm(25℃) 6
Shear strength GB/T 7124-2008 mPa·s ≥20
Impact strength GB/T 1843-2008 KJ/m2 15
Glass transition temperature GB/T 22567-2008 ℃ 110
Coefficient of thermal expansion GB/T 1036-2008 U m/m / ℃ <Tg, 45
>Tg, 152
Thermal cracking temperature TGA 10℃/min ℃ 290
Water absorption GB/T 8810-2005 24h, 25 ° C, % 0.45
Dielectric strength GB/T 1692-2008 kV/mm (25 ° C) 22
Dielectric loss GB/T 1693-2007 (1MHz) (25 ° C) 0.006
Dielectric constant GB/T 1693-2007 (1MHz) (25 ° C) 3.1
Volume resistance GB/T 1692-2008 DC500V,Ω· cm 5.20E +14
EP 3090 transparent epoxy structural adhesive
Order code: A: 2KEP6670; B: 2KEP6671; A+B: 2KEP6672
MDEP 3090 black epoxy structural adhesive
Order code: A: 2KEP6611; B: 2KEP6671; A+B: 2KEP6678
l Component A: 1 kg/barrel; Component B: 1kg/ bottle;
l Component A: 5 kg/barrel; Component B: 5kg/ bottle;
l A+B double tube package, 50ml/ bottle
l A+B double tube package, 400ml/ piece
Please don't order directly, if you have any doubts, welcome to talk more with us.+8618321208486
