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Epoxy Resin Potting & Encapsulation Compounds

Ep3102 High Performance Epoxy Potting Compounds and Adhesives

£2.10Price
£0.27 per 3.85 Kilograms
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Ep3102 High Performance Epoxy Potting Compounds and Adhesives

high-performance epoxy used primarily for potting and encapsulating electronic circuits.

High-performance epoxy potting compounds are two-part resin systems designed to permanently encapsulate electronic circuits, PCBs, and sensitive components. They provide extreme protection against moisture, thermal shock, and physical impact while offering high dielectric strength.c

When selecting the best compound for your project, consider three primary variables:

Exothermic Heat: Large potting volumes require slow-curing epoxies to prevent the curing reaction from generating damaging, runaway heat.

Viscosity: Low-viscosity formulations are necessary to deeply penetrate densely packed boards and avoid air gaps.

Coefficient of Thermal Expansion (CTE): Matching the potting compound's expansion rate to that of the components prevents solder joint fatigue during temperature cycling.

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